The Hong Kong Power Semiconductor Chip and Application R&D Centre (PowerSAC) held its unveiling ceremony at Hong Kong Science Park on 18 September 2026, marking the official start of its operations. Representatives from the Innovation and Technology Commission, HKUST and industry attended.
Speaking at the ceremony, Centre Director Prof. Jing CHEN said power semiconductors are a foundational technology for energy efficiency. "From data centre power delivery to EV charging, losses at every stage translate directly into carbon emissions. Our aim is to put materials, devices, ICs and system validation under one roof so results leave the lab faster."
Four research pillars launched
The centre's four research areas were launched on the same day: wide-bandgap materials and advanced power devices; power ICs and intelligent gate driving; high-efficiency power conversion; and system-level validation and demonstration.
- Joint research projects with local universities and the Microelectronics Research Institute
- Phase-one construction of device characterisation and reliability platforms
- Industry discussions on data centre power and on-board charging
Forum focuses on AI power delivery
The inaugural forum featured sessions on AI data centre power delivery, wide-bandgap device reliability and academia-industry collaboration, attracting more than 200 participants.
"We want PowerSAC to be more than a laboratory — a connection point for Hong Kong's power semiconductor ecosystem." — Prof. Jing CHEN, Centre Director